General Electric DS200TCEBG1AAB工业控制系统 EOS 卡
General Electric DS200TCEBG1AAB Industrial Control System EOS Card
Product Type:Printed Circuit Board Application:Industrial Control Systems Module Class:Common Circuits Series:Mark V Card Type:EOS Number of Channels:N/A Interface Protocol:VME Operating Temperature Range:-40"C to +70"C Power Consumption:N/A Dimensions (WxHxD):165.3 x 110.5 x 28.5 mm Weight:0.5 kg Material:High-grade copper, FR-4 composite Certifications:ISO 9001, CE, UL The General Electric DS200TCEBG1AAB Common Circuits EOS Card is engineered to offer unparalleled performance in demanding industrial environments. Its compact yet powerful design ensures seamless integration into existing automation systems, enhancing efficiency and reliability.
Featuring advanced circuitry, this card is capable of handling high-speed data transfer and complex control tasks with ease, making it ideal for applications requiring precise control over motors, valves, and other critical machinery components.
With a wide operating temperature range and robust voltage tolerance, the DS200TCEBG1AAB is built to withstand harsh industrial conditions without compromising on functionality. Its durable construction ensures longevity and minimal maintenance requirements, reducing downtime and costs associated with system upkeep.
The inclusion of an RS-485 communication interface facilitates smooth data exchange between the card and other components within the automation system, enabling sophisticated control strategies and enhanced system interoperability. Backed by General Electric reputation for quality and innovation, the DS200TCEBG1AAB Common Circuits EOS Card is an essential upgrade or addition to any industrial automation project. It delivers exceptional value through its combination of cutting-edge technology, reliability, and ease of integration, ensuring your operations run smoothly and efficiently.
The General Electric DS200TCEBG1AAB is a specialized Common Circuits EOS Card designed for seamless integration into industrial automation systems, ensuring precise control and reliability in complex environments.
Quality Assurance
(A) Precision manufacturing process
Circuit Board Manufacturing: Advanced multi-layer printed circuit board (PCB) technology is adopted, and through optimised line layout and high-precision etching process, the precision of line width and spacing is controlled at the micron level, which effectively reduces signal interference and improves the stability of the card's electrical performance. During the circuit board welding process, high-precision surface mount technology (SMT) is used to precisely mount the electronic components on the circuit board, and each soldered joint is strictly inspected, and X-ray inspection equipment is used to check whether there are any defects such as false soldering and voids inside the soldered joints to ensure the reliability of the circuit board's electrical connection.
Module assembly: During the assembly of EOS cards, high-precision automated equipment is used to strictly control the assembly precision of each component. The dimensional accuracy and contact performance of key components, such as communication interfaces and input/output interfaces, are strictly controlled to ensure the stability and signal transmission quality when connecting with external devices. The shell of the card is made of high-strength, fire-resistant and anti-electromagnetic interference materials, and after precision machining process, the dimensional accuracy and mechanical strength of the shell are ensured to provide good protection for the internal electronic components.
